3D Printing for microfabrication and mechanical stress characterization in flexible electronics

Authors

  • A. Gonzalez Instituto Tecnológico Superior de Ciudad Serdán
  • O. Obregon Benemérita Universidad Autónoma de Puebla
  • S. Ceron Benemérita Universidad Autónoma de Puebla
  • S. Soto Benemérita Universidad Autónoma de Puebla
  • M. A. Dominguez Benemérita Universidad Autónoma de Puebla

DOI:

https://doi.org/10.31349/RevMexFis.71.061003

Keywords:

Flexible electronics; Microfabrication; Mechanical stress; bending test

Abstract

In this work, the application of 3D printing for microfabrication and mechanical stress characterization in flexible electronics is presented. The 3D printing method used is fused deposition modeling with polylactic acid (PLA) filament as an eco-friendly alternative. For mechanical stress characterization, a 3D device is designed to be adapted to the requirements of flexible samples showing accuracy, versatility and easy implementation in any probe-station. For microfabrication, a PLA 3D shadow mask is used to transfer silver patterns to flexible substrates such as Polyethylene Terephthalate (PET) and photographic paper. A systematic study to evaluate the mechanical stress in the silver patterns is conducted using the 3D printed devices previously designed. The silver film is evaporated using a thermal evaporating coater. Finally, to demonstrate a flexible Printed Circuit Board (PCB) application, a silver path evaporated on PET substrate is used as a transmission line for a sine electrical signal. The flexible PCB exhibits a reliable electrical operation even when the substrate is bent.

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Published

2025-11-01

How to Cite

[1]
A. . Gonzalez, O. Obregon, S. Ceron, S. Soto, and M. A. Dominguez Jimenez, “3D Printing for microfabrication and mechanical stress characterization in flexible electronics”, Rev. Mex. Fís., vol. 71, no. 6 Nov-Dec, pp. 061003 1–, Nov. 2025.

Issue

Vol. 71 No. 6 Nov-Dec (2025): Revista Mexicana de Física

Section

10 Material Sciences

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Copyright (c) 2025 A. Gonzalez, O. Obregon, S. Ceron, S. Soto, M. A. Dominguez

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